FAQs


	General Information\|XPCs\|TFTs\|XPC Barebones\|XPC Accessories\|

Support | 02/09/2004 15:13:00

Adhesive thermal silicone gel on P4 CPU die?

Adhesive thermal silicone gel such as Shin-Etsu Silicone will set after about 6 hours and form a strong bond between the heatsink and CPU die or other applied surfaces (eg. memory module, chipsets). This type of adhesive thermal compound is strongly not recommended to use on P4 Socket 423/478 CPU die.

Adhesive thermal silicone gel such as Shin-Etsu Silicone will set after about 6 hours and form a strong bond between the heatsink and CPU die or other applied surfaces (eg. memory module, chipsets). This type of adhesive thermal compound is strongly not recommended to use on P4 Socket 423/478 CPU die. Since fan heatsink will stick strongly to the P4 CPU die and due to P4 Socket 423/478 ZIF socket structural design, upon removal of the heatsink will force P4 CPU to break apart from the ZIF socket thus damaging both pins on P4 CPU and ZIF socket. Please use non-adhesive thermal compound for P4 CPU only to avoid any damage done to the ZIF socket and P4 CPU.

Shuttle Newsletter

Become officially listed in the Where-to-buy section

You are a retailer with a local store or online shop and sell Shuttle products? You would now like to become listed as an official reseller for Shuttle products? Register now for the Shuttle Reseller Program in order to compete for a listing as an official Shuttle reseller.

The K-Series is Shuttle’s most cost-effective Mini-PC model range. The K-Series is ideal for the office and simple daily routine applications.

Back

2009